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| author | Denys Dmytriyenko <denys@ti.com> | 2016-04-21 14:44:22 -0400 |
|---|---|---|
| committer | Richard Purdie <richard.purdie@linuxfoundation.org> | 2016-04-29 07:34:10 +0100 |
| commit | 9ab934e4aecb759c922049245888dcd2a8c55477 (patch) | |
| tree | f3094dd08b8656c1542aaa79245bce4470298cbc /meta/classes/cmake.bbclass | |
| parent | 5084ed9401250ed269a49d27b303806ab173c5d5 (diff) | |
| download | openembedded-core-9ab934e4aecb759c922049245888dcd2a8c55477.tar.gz openembedded-core-9ab934e4aecb759c922049245888dcd2a8c55477.tar.bz2 openembedded-core-9ab934e4aecb759c922049245888dcd2a8c55477.zip | |
sdk.py: preserve packaging data when SDKIMAGE_FEATURES has "package-management"
This is not enabled by default, as there are still limitations and possible
issues with opkg (and rpm?) packaging data containing broken symlinks for
local indexes:
http://cgit.openembedded.org/openembedded-core/commit/?id=c8e0ec2da9ad4ce1c103966906a85f68c15400dd
There are other use cases for the packaging data to be available in SDK,
since it provides comprehensive info about SDK's contents and in the case of
opkg and dpkg is all text-based and can be easily parsed by simple scripts.
Introduce new "package-management" flag for SDKIMAGE_FEATURES list (similar
to the one already used for IMAGE_FEATURES) that controls presence of the
packaging data in resulting SDK, while unifying this behavior across the
board for supported pkg managers - rpm, opkg, dpkg.
Signed-off-by: Denys Dmytriyenko <denys@ti.com>
Signed-off-by: Ross Burton <ross.burton@intel.com>
Diffstat (limited to 'meta/classes/cmake.bbclass')
0 files changed, 0 insertions, 0 deletions